Silicon Carbide MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors) are essential elements in power electronic applications, offering wide bandgap, high breakdown voltage and current density characteristics.
These power supplies are particularly suited for hard-switching topologies like LLC and ZVS, providing higher system efficiency with smaller components for more compact designs at reduced system costs and an energy efficient power source with a lower Miller capacitance.
Guasto ad alta tensione
Silicon carbide’s higher breakdown electric field than silicon enables it to be used for higher voltage devices, including inverters, motor drives and photovoltaic solar inverters that switch at high frequency, thus avoiding overheating which could result in thermal runaway failure. This makes silicon carbide ideal for applications involving higher current.
SiC MOSFETs can be designed to withstand high levels of transients caused by lightning strikes and switchgear arcing without needing derating, which reduces performance and shortens device lifespan. This enables more robust systems with lower overall costs and footprint, greater reliability and efficiency compared with conventional IGBTs or power MOSFETs.
SiC’s n-layer is much thinner and can be more heavily doped, leading to much lower resistance at any given breakdown voltage, meaning they require significantly less current for operation at equal voltage, further reducing switching losses and energy consumption of systems.
SiC MOSFETs also boast an oxide barrier height 3.3 times greater than that found in silicon MOSFETs, making it more difficult for electrons to tunnel through and cause short circuit failure. Furthermore, tests conducted under different inductances, ambient temperatures and gate drive voltages have shown that their avalanche capacity remains insensitive to temperature – further evidence that SiC has more stable avalanche behavior than silicon counterparts [51].
Alta densità di corrente
Silicon carbide power MOSFETs can offer greater current density than their silicon counterparts due to having an electric field strength 10 times greater, enabling thinner drift layers within the device and decreasing overall channel resistance.
SiC devices boast wide bandgaps that contribute to thinner depletion regions, making them capable of handling higher voltages and currents without experiencing damage or breakdown – an advantage which makes them suitable for various power applications.
SiC devices also benefit from having lower on-resistance than silicon counterparts, meaning less power is lost during switching and increasing efficiency – an aspect which makes SiC an especially great choice for battery powered devices, where energy efficiency is of great significance.
SiC MOSFETs boast another advantage in that they are suitable for operation across a wide temperature range, due to having a lower thermal expansion coefficient than silicon devices and maintaining their physical properties in extreme temperatures. This makes them suitable for applications such as uninterruptible power supplies (UPS), solar PV inverters, and electric vehicle charging stations.
Low On-State Resistance
Silicon carbide MOSFETs boast lower on-state resistance than SiIGBTs and can handle higher current. Their properties make them suitable for power supply applications, including uninterruptible power supplies (UPS), electric vehicle battery chargers and photovoltaic (PV) inverters.
MOSFETs boast several key advantages over other device technologies like Si IGBTs in terms of inversion channel design; this has an indirect but direct influence on Tc (thermal coefficient) values of the devices they replace, with much lower on-state resistance levels and consequently much lower thermal coefficient values than rival devices – leading to greater efficiency and lower system costs as a result.
Silicon Carbide MOSFETs also boast lower threshold temperatures because there is no negative temperature impact from gate oxide layers like in SiIGBTs, helping reduce conduction losses in the device and on-state resistance which leads to significant improvements compared to traditional silicon devices.
SiC MOSFETs feature higher switching speeds that enable them to operate at higher frequencies, leading to significant gains in power conversion efficiency as well as reduced component sizes for inductive and capacitive components. This is especially advantageous in critical power supply electronics applications where increased efficiencies and smaller component sizes help lower system costs while simultaneously improving reliability.
Alta conducibilità termica
Silicon carbide boasts superior thermal conductivity over silicon, which allows it to handle much higher power levels with lower temperatures while simultaneously minimizing both switching losses and heat production, leading to greater energy efficiency levels and smaller magnetics allowing designers to further reduce system weight and size.
SiC devices benefit from having high breakdown electric field strength, enabling them to switch more rapidly than their silicon-based counterparts and thus increasing efficiency levels while mitigating harmful parasitic turn-on effects like Miller capacitance. Furthermore, SiC devices’ faster switching speeds help mitigate undesirable parasitic turn-on effects like Miller capacitance.
These benefits have led to many new applications of SiC MOSFETs, particularly within power conversion systems such as electric vehicle charging systems where their fast switching speeds help mitigate transients and protect the battery pack from damage.
Selecting an effective wide bandgap semiconductor requires careful consideration of voltage, current and temperature ratings as well as gate drive circuitry of each device. Matching device characteristics to your specific requirements is vital in order to prevent damage or failure while also optimizing performance and longevity. Cooling solutions with quality thermal interface materials will further enable you to achieve the maximum possible performance and reliability from your power system.